EMBEDDED DIGITAL IMAGE CORRELATION FOR FULL-FIELD STRAIN MEASUREMENT

Proof of Concept Project (OP TAK)

Project ID: CZ.01.01.01/08/25_078/0008533
Funding: European Union – Operational Programme Technologies and Applications for Competitiveness (OP TAK)
Duration: 2026–2027

PROJECT OVERVIEW

This project focuses on the development and validation of an embedded Digital Image Correlation (DIC) technology for full-field strain measurement. The objective is to verify the technical feasibility and commercial potential of a compact system capable of performing deformation analysis directly within the device.

Unlike conventional solutions where data processing is performed externally, the proposed approach integrates image acquisition and data evaluation into a single embedded unit. This enables more efficient deployment, faster data processing, and simplified operation in real-world applications.

The project is implemented as a Proof of Concept activity aimed at validating the technology and preparing it for further development and commercialization.

KEY FEATURES

  • Embedded Digital Image Correlation (DIC) processing
  • Full-field strain and deformation measurement
  • Integrated data acquisition and evaluation
  • Compact and autonomous system design
  • Designed for practical deployment and scalability

APPLICATIONS

  • Experimental mechanics and material testing
  • Structural diagnostics and deformation analysis
  • Research and development applications
  • Preparation for industrial deployment

This project is co-funded by the European Union under the Operational Programme Technologies and Applications for Competitiveness (OP TAK).

EUMPO Barevne EN

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