- Universal solution for all engineering measurements
- Ideal for component and material testing
- Adjustable for wide range of applications
- Easily upgradable to 3D DIC system
The X-Sight 2D DIC system is a straightforward single- or multi-camera measuring device suitable for experimental validation of your designs, calculations, and numerical simulations. It is ideal for assessing various mechanical characteristics of your machines, assemblies, and structures.
Equipped with advanced digital image correlation software, X-Sight 2D DIC provides precise and accurate real-time strain and deformation measurement and delivers results with nanometric resolution. Software postprocessing allows for comfortable browsing and reassessment of stored data from previous measurements.
The system can also be used as the most advanced customized optical extensometer and can be easily upgraded to X-Sight 3D DIC.
TECHNICAL SPECIFICATIONS
| M5 | M16 | M24 | |
|---|---|---|---|
| RESOLUTION | 5 MPx | 16.1 MPx | 24.5 MPx |
| FPS AT FULL RESOLUTION | 75 Hz | 23 Hz | 15 Hz |
| MEASUREMENT LENGTH CLASS 0.5* | 130 × 110 mm | 330 × 180 mm | 330 × 285 mm |
| MEASUREMENT LENGTH CLASS 1* | 260 × 220 mm | 660 × 360 mm | 660 × 570 mm |
| MEASUREMENT LENGTH CLASS 2* | 520 × 440 nn | 1320 × 750 mm | 1320 × 1140 mm |
| INTERFACE | USB 3.0 | ||
*compliant to ISO 9513
- In-Plane subpixel resolution: < 0.008%
- Out-of-Plane movement reduced by special lens type (optional)
- Strain resolution 50 microstrains
- 10 microstrains with time averaging
- 5 microstrain in optical extensometer mode
- Strain range from 0.005% to > 2000%
- Measuring area (specimen size) range from 1 mm to 100 m
- < 5 mm specimen must be measured with a special microscope
- 10 m specimen can only be calibrated using the LOCF (Large Object Calibration Function)
- DIC of natural patterns, speckle patterns, image features and markers
APPLICATION EXAMPLES
Upgrade Ready: From DIC 2D to 3D
The DIC 2D system is engineered for seamless upgradeability to 3D, catering to evolving measurement needs. This ensures an efficient transition to advanced 3D analysis when required, maximizing investment value by extending the system’s applicability without the need for new hardware.
